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With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
The relations between process and product characteristic of straw packaging material and the influence of density of straw packaging material on its performance were studied.
研究了麦秸防护内衬包装材料的工艺和产品特性之间的关系，以及密度对这种材料性能的影响。
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