... package advance外壳引线 packaged chip封装的集成电路 packaged integrated circuit封装的集成电路 ...
基于118个网页-相关网页
·2,447,543篇论文数据,部分数据来源于NoteExpress
Also to perform disconnection of ESD protection device from input pad once the packaged chip is placed in system.
当封装芯片置于系统中时,还完成将ESD保护装置从输入焊盘断开。
youdao
Using a new 3-D chip design that stacks more capacity in the same amount of space, Matrix claims that it can deliver packaged content faster and less expensively than masked ROM and avoid the moving parts that plague discs.
ENGADGET: Switched On: Mattel's Juice Box Enters The Matrix
应用推荐
模块上移
模块下移
不移动