In this paper, the merits and demerits, the key technology, the recent development and the developmental prospects for chip stacking and package stacking are introduced.
文章介绍了芯片堆叠和封装堆叠的优缺点、关键技术、最新动态和发展前景。
They can be classified into wafer level, chip level, and package level stacking.
它们可以分为圆片级封装、芯片级封装、和封装面。
应用推荐