The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.
该器件提供两种封装：24引脚、0.3英寸宽、塑料密封双列直插式封装(DIP)和24引脚小形集成封装(SOIC)。
The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."
该器件提供两种封装：8引脚、0.3英寸宽、小型塑料或密封双列直插式封装（小型DIP）；以及8引脚小形集成封装（SOIC）。
应用推荐