After putting the product into package container and sealing it, the environment between surface of the product and package material is called package inner environment.
将产品置于包装容器内并密封后,产品的外表面与包装材料内壁之间所形成的微环境称为包装内环境。
参考来源 - 产品包装内环境调控技术模型及其应用Nowadays, the micromation is mainly one of the development aspects of printed circuit board (PCB) and the package of electronic components. The polymer-based electronic package material has been proved to be promising for use in the package of electronic components.
微型化已经成为印刷线路板和电子封装材料发展的主要方向之一，聚合物基电子封装材料在电子器件封装应用中具有广阔前景。
参考来源 - 高导热低介电氮化铝/聚酰亚胺纳米复合薄膜的制备和性能研究The result reaches the performance request of adhesive in BB/T0016-1999“Package Material Honeycomb Paperboard”.
实验制取的粘合剂通过了BB/T0016-1999《包装材料蜂窝纸板》中对粘合剂的性能要求。
参考来源 - 稳定快干蜂窝纸板粘合剂的研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Lead package material supplier and packing centre technical qualification.
负责包装材料供应商和包装中心的技术认证。
Our company is specialized in sale of package machinery and package material.
本公司专业从事包装机械及包装材料的销售。
Be responsible for production material and package material storage management and control;
负责生产材料和包装材料的在库管理和控制；
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