Ceramic Package 陶瓷封装 ; [电子] 陶瓷组装 ; [电子] 陶瓷外壳
metal ceramic package 金属陶瓷外壳
glass ceramic package 玻璃 ; 玻璃陶瓷外壳
package ceramic leaded chicarrier 陶瓷式引线芯片承载封装
ceramic and metal package 金属陶瓷外壳
ceramic flat package 陶瓷扁平封装 ; 陶瓷扁平管壳
multi-layer ceramic package 多层陶瓷封装
Side-brazed Ceramic Package 侧面铜焊陶瓷封装
ceramic air package 陶瓷空气封装
The characteristics of ceramic artworks were analyzed, and the universality and essentiality of buffering package were described in this paper.
分析陶瓷工艺品的特点，说明缓冲包装的普遍性和重要性。
According to the functional requirements, their technical characteristics consist of two ways on seal, ceramic package seal weld and tube polysulfone whirl forge seal, and the compact structure.
根据功能要求，本电气贯穿件的技术特点是采取了陶瓷组件封焊和钢管聚砜旋锻密封两种密封方法，以及紧凑的结构方式。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
应用推荐