CONCLUSION: Polymerization shrinkage of composite resin has negative effect on bonding strength of adhesives.

结论：树脂固化时的体积收缩可在黏结层产生较大的应力，影响黏结强度。

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LED is the heart of a semiconductor chip, the chip is attached to one end of a stent, is the negative side, the other end of the power of the cathode, the entire chip package to be epoxy resin.

LED的心脏是一个半导体的晶片，晶片的一端附在一个支架上，一端是负极，另一端连接电源的正极，使整个晶片被环氧树脂封装起来。

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