... multilayer printed wiring board 多层印刷布线板 multilayer thick film technology 多层厚膜工艺 multilead transistor case 多引线晶体管管壳 ...
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A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
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