Multilayer chip inductors use magnetic material and multilayer technology in producing revolutionary inductors which do not use any wire windings.
在生产贴片电感时使用磁性材料和积层技术，而不使用任何线绕。
The silver diffusion mechanism in low temperature cofired microwave dielectric ceramic components fabricated by using multilayer technology was studied.
研究了叠层共烧工艺制备的微波介质陶瓷器件的银扩散机制。
A survey to make high density multilayer thick film surface mount assembly and measures adopted for mount design and manufacturing technology for them are introduced.
介绍了研制大面积高密度多层厚膜表面组装件的概况及组装设计与制造工艺上所采取的措施。
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