... Imaging Processes成象工艺 Single Layer Resist单层光刻胶 Multilayer Resist多层光刻胶 Antireflecting Layers防反射层 ...
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And by the means of silicide, resist layer and aluminium multilayer metal lines, the questions of ohmic-contact and A1 electron mobility are resolved.
采用硅化物阻挡层和A1多层金属布线方法，解决了欧姆接触和铝的电迁移问题。
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