Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayer circuit and fired in a certain atmosphere in high temperature.
多层共烧氮化铝陶瓷是采用厚膜印刷的方式将多层的电路金属化做入氮化铝基板并在特定气氛中高温烧结的一种高性能陶瓷。
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