Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
多层印制板的制作是一个生产工序复杂且周期很长的过程，那么造成金属化孔镀层空洞的原因也就很复杂。
Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board.
用于挠性印刷线路板的具有基材的粘合片，其制造方法，多层挠性印刷线路板和挠性-刚性印刷线路板。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
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