The reasons of plating layer blister on multilayer ceramic package are analyzed. On the base of practice the resolve methods are indicated.
本文对多层陶瓷外壳电镀层起泡的成因进行了探讨和分析。在实际工作的基础上，提出了解决起泡应采取的措施。
The package is a multilayer ceramic structure and has the electrical interconnection with logical function.
该封装为多层陶瓷结构，并具有电连接逻辑关系。
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