Properties and preparing process of tri layer films with Ag base coating, Ni electrodeposit, Sn Pb alloy for terminal electrode of multilayer chip inductor were described.
介绍了叠层片式电感三层端头电极即银基底电极、镍层、锡-铅合金镀层的性能及制备工艺。
Small size multilayer chip inductor for high frequency high Q, stable inductance in high freq. range.
小尺寸且适用于高频,高Q值及在高频带有稳定感值应用的积层晶片电感。
I have designed the multilayer chip inductor take this material as the foundation and discussed a little influences of the metal wire arrangement structure and via in the parameters of inductor.
在以此材料为基础设计了多层片式电感,初步探讨了金属导线的布置结构及通孔对电感元件的一些参数的影响。
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