... Maximum Likelihood --最大可能性 Multi-Layer Ceramic --多层陶瓷 Micro Lead Package --微引线封装 ...
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Multi -Layer Ceramic Capacitor 高压积层陶瓷电容 ; 专业高压积层陶瓷电容 ; 高压贴片陶瓷电容
multi-layer ceramic package 多层陶瓷封装
Chip multi-layer ceramic capacitors 片式多层陶瓷电容器
multi-layer ceramic structure 多层陶瓷结构
Multi-layer Ceramic Capacitor 多层陶瓷电容
multi-layer ceramic substrate 多层陶瓷基板
Multi-layer Ceramic Transformer 多层陶瓷片式变压器
multi-layer ceramic microwave filter 多层陶瓷微波滤波器
multi-layer serial ceramic capacitor 多层串联陶瓷电容器
Conventional MMCM package technologies are usually base on techniques like single-layer or multi-layer ceramic substrates, wire-bonding or flip-chip as chip-to-package interconnects, thick or thin film and flexible materials as dielectrics.
传统的MMCM封装技术采用单层或多层陶瓷基板、用引线键合或倒装焊方式引出芯片信号,在某些方面表现出不错的性能。
参考来源 - 硅埋置型微波多芯片组件封装研究·2,447,543篇论文数据,部分数据来源于NoteExpress
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