Conventional MMCM package technologies are usually base on techniques like single-layer or multi-layer ceramic substrates, wire-bonding or flip-chip as chip-to-package interconnects, thick or thin film and flexible materials as dielectrics.
传统的MMCM封装技术采用单层或多层陶瓷基板、用引线键合或倒装焊方式引出芯片信号,在某些方面表现出不错的性能。
参考来源 - 硅埋置型微波多芯片组件封装研究·2,447,543篇论文数据，部分数据来源于NoteExpress
We also provide different multi-layer ceramic structures, ceramic chip capacitor and ceramic dielectric resonator.
提供各种异型陶瓷件，以及陶瓷片式电容，陶瓷介质谐振器。
The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing.
本发明是关于一种通过喷墨涂布同时涂布内电极和外电极的多层陶瓷电容器。
Mathematical model of multi-layer composite artillery barrel with ceramic liner was built by using axisymmetric elastic theory, and stress computer program of the composite barrel was developed.
应用轴对称弹性理论建立了陶瓷内衬多层复合身管的数学模型，编写了其应力计算程序。
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