专业释义
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脱模 - 引用次数：2
During molding process, silicon die crack failures might occur in some types of thin small outline package (TSOP) at mould release step. This step is simulated by finite element method to clarify the mechanism of silicon die crack failures.
针对TSOP封装在塑封工艺中脱模时可能发生的芯片碎裂,采用有限元法模拟封装脱模阐明了芯片碎裂失效的机制。
参考来源 - TSOP失效和多晶硅薄膜晶体管自加热效应的有限元分析和模拟
·2,447,543篇论文数据，部分数据来源于NoteExpress
双语例句
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To avoid interference, compounds containing Br or I can be used as mould release agent.
为避免对于测定元素的干扰，可分别选用溴或碘的化合物作为脱模剂。
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It can save the electricity and oil and is compatible with the mould release cylinder of the former mould release device .
该装置省电、省油，并能与原液压脱模装置的脱模缸兼容。
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Mould release agents cannot be used in the fabrication of this part because it must undergo another bonding phase which requires a clean application surface.
为了防止给下面的工序造成污染，因此不能使用脱模剂。
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