In this paper the effect of size of silver particles, proportion, curing agent and curing condition on epoxy resin - low - molecular polyamide - silver particles system are studied and discussed.
本文着重从银粉的粒度、添加量和固化剂的种类、用量以及固化条件等方面研究和探讨了环氧-低分子聚酰胺-银粉导电胶体系的导电性及强度。
The relationship between the factors such as the molecular weight of copolymer and PEG, the proportion of monomers and PEG, have been discussed.
同时讨论了共聚物单体配比、PEG分子量、PEG与马来酸酐的投料比与酯化产物的性能关系。
Results indicated that changing the proportion between the acid and alcohol could control the molecular weight of the polyesters and the modified poly-(butylenes su…
实验结果表明，改变酸醇比例可以控制聚酯分子量，扩链改性后的产物结晶度下降、力学性能提高、降解性能也得到改善。
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