...压基板、软性电路板(flex circuit/tape substrates)、导线架(leadframes)、打线接合(wire bonding)、模压化合物(mold compounds)、底胶添补(underfill)质料、液态封装质料(liquid encapsulants)、粘晶质料(die attach materials)、焊球(solder balls)、晶圆级...
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Not only does this effectively eliminate ethylene gas, it has also been clinically proven to eradicate volatile organic compounds (VOCs), viruses, bacteria, fungi, and mold, even anthrax.
这不仅有效地消除乙烯气体，它也被临床证明，以消除挥发性有机化合物(VOCs)，病毒，细菌，真菌和霉菌，是炭疽。
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