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mold compound

  • 模压胶料:一种用于电子元器件封装的材料,通常由树脂、填料和固化剂组成。

双语例句

  • The compound mold manufacturing and application example suitable for large thin-walled complicated Al-alloy castings were described.

    大型薄壁复杂铝合金铸件对象,叙述了复合铸型制造应用范例

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  • This design elaborated the manufacture "the axis seals the end cover" compound mold design.

    设计阐述制造端盖”的复合的设计。

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  • Using mold prepared by compound method, on the basis of different drying time curve attained by changing environmental humidity and temperature, the optimized processing parameters were determined.

    采用复合法制壳,制备过程改变不同环境湿度温度得到型壳的不同干燥时间曲线确定工艺参数优化值

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