1．1低温烧结铁氧体材料的研究目的、范围和方法 现代的多层片式电感（MLCI）主要是采用在磁性介质材料上印刷Ag电极再层叠 起来一起烧结而成的工艺。它的解剖结构如图1。
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multilink channel interface MLCI 多链路信道接口
Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.
对锡-铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。
Solderability of Sn Pb alloy deposit is determined by electroplating process and its maintenance, post treatment rinsing, storage of MLCI, etc.
MLCI端头电极锡-铅合金电镀工艺及维护、镀后的清洗、MLCI的储存影响镀层的耐焊性和可焊性。
The crystal-structure, fabricating process and electronic-magnetic properties of the low-temperature-sintered hexagonal ferrites applied in Multilayer Chip Inductor(MLCI) are introduced in this paper.
本文主要介绍了多层片式电感用低温烧结六角晶系铁氧体的晶体结构、制备工艺及电磁特性。
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