IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
Microelectronics packaging machine control technology used in Japan to achieve a safe and unmanned operation, high productivity, greatly enhance the international competitiveness on the market.
日本用微电子技术控制包装机，达到安全性高、无人操作、高生产率，大大提高了国际市场竞争能力。
Microelectronics connecting technology plays an important role in the microelectronics packaging.
微电子连接技术是微电子封装技术中的重要环节。
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