Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly.
帕洛马技术3500 III执行全自动晶圆级封装和先进的微电子组装。
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.
在微电子中，使用电线将数据包的引线与芯片上的结合区相连接的过程。装配过程的一部分。
He can be widely used in the electronic assembly, microelectronics, biological products, pharmaceutical, injection molding, printing, etc.
他能够广泛的应用于电子装配、微电子制造，生物制品、制药、注塑、印刷等行业。
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