This paper describes a fabrication technology of metal tip field emission arrays (FEA) for the vacuum microelectronic devices.
本文介绍了真空微电子器件场发射金属尖阵列阴极的制备工艺技术。
A process for the fabrication of Si cone cathode for the build up of vacuum microelectronic devices is proposed and its experimental results are given.
本文介绍了利用半导体硅材料制作的真空微电子器件的核心部件，场致发射硅锥阴极，的工艺研究及实验结果。
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