The principle of the new microelectronic devices, spin transistor and spin valve transistor is reviewed.

介绍了新型微电子器件自旋晶体管和自旋阀晶体管的工作原理。

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The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.

应力是导致焊球失效的直接原因，进而致使器件失效。

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This paper describes a fabrication technology of metal tip field emission arrays (FEA) for the vacuum microelectronic devices.

本文介绍了真空微电子器件场发射金属尖阵列阴极的制备工艺技术。

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Wire-bonders are devices essential to the efficient manufacture of high quality computer chips and other microelectronic devices.

CENTERFORSECURITYPOLICY: Center For Security Policy