Micro-via board 微小孔板
micro via desmearing 微孔清洗
micro via of substrate 基板微细孔
Micro-Through Via 或微导通孔
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺,同时给出了相关的工艺条件和电镀效果。
Within each phase, you must achieve a major milestone via the execution of one or more micro iterations before the next phase can begin.
在每个阶段中,您必须在下一个阶段开始之前,通过执行一个或多个微迭代来实现一个主要的里程碑。
An edge detection method of noisy micro image was proposed where threshold was performed via statistical principles.
针对复杂噪音干扰的显微图像,提出一种新的基于统计原理的边缘检测阈值分析方法。
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