再对Momentum 中substrate 进行相应设置,分为介质层(substrate layer) 的设置和金属层(metallization layer)的设置,将实际电路板所使用的板材 FR4 参数对应添加。
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metallization layer stability 金属化层稳定性
one layer metallization 单层金属化
single layer metallization 单层金属化
multiple layer metallization 多层金属化
double layer metallization 两层金属化
According with an embodiment of the invention, the heating layer USES metal or metallization flexible material, and can control the heating surface on required correct place.
按照本发明的实施例，发热层采用金属及金属化的柔性材料，因此可将发热面控制在所需的正确部位。
The AES suggests that the interaction between gate metallization and GaAs active layer has taken place and the Schottky contact interface becomes ambiguous after stressing.
应力试验后的样品，肖特基势垒接触界面模糊，有明显的互扩散和反应发生．。
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