The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
The vacuum obtains and maintenance is still still the main problem in the field of MEMS vacuum packaging technology.
真空的获得和维持是目前MEMS真空封装技术中存在的主要难题之一。
应用推荐