semiconductor memory component detail 半导体存储元件
shape memory component 形状记忆元件
Memory Component Interposer 内存器件插补器
semiconductor memory component 半导体存储元件
memory interface component 存储器接口元件
The application of virtual instrument (VI) in memory component testing is described in this paper.
论述了虚拟仪器在存储元件测量中的应用;
Theshared memory component of IDS is at instance level and is divided into three segments, as shown in the Figure 4 above.
IDS的共享内存组件属于实例级,被分为三个部分,如上面图4所示。
Memory structure is the most complicated component of the IDS architecture.
内存结构是 IDS 体系结构中最为复杂的组件。
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