Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
The results show that the free-lead solder powder is best in the efficient atomization efficiency, size distribution and degree of sphericity with helium as the atomizing medium.
结果表明：在一定雾化条件下，氦气雾化粉末具有最高的有效雾化率、良好的粒度分布，且球形度最好；
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