Only enabled mechanical layers can be part of the database.

不仅使机械层可以是数据库的一部分。

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So this paper introduces the structure layers of KBE technology, and ADAPTS it to mechanical product DE signing.

为此本文介绍了K BE技术的结构层次，并将其应用到机械产品的设计中去。

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Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.

半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。

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The outer two layers are made up of PZT-5H - a ceramic substance that produces an electrical charge when mechanical stress is applied.

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