This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.

本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。

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This paper describes the CAD method for MCM-C, the fabrication and metallization processes of MCM-C substrates, and the technologies for die test, burn-in and interconnection.

介绍了MCM-C的CAD设计方法，以及MCM-C基板的制作与金属化、芯片的测试和老化、芯片互连等工艺。

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Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.

多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。

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