A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed.
引入了快冷锡基软钎料的浸润性模型,并进行了计算处理。
The proposed methods are based on the modal coordinate equations, to avoid the tedious mathematical manipulation.
该方法建立在模态方程的基础上,避免了繁杂的数学过程。
Additionally, a mathematical manipulation is adopted to remove the second-order spacial derivatives in the body surface boundary condition.
对二阶物面边界条件采用数学手段,推导出一个没有二阶空间导数的表达式,以便于计算。
应用推荐