The orientation of disturbance factor vector is the same as that of vector of material unit stress.
扰动因子向量的方向与材料单元体应力主方向相同。
The processing characteristics and some material properties of silicon wafers depend on the orientation .
硅片的工艺性质与某些材料特性均与晶向有关。
Nowadays, the method based on the acoustic emission technique is commonly used in the material crack damage orientation.
采用声发射技术进行材料裂纹损伤定位是当前较为常用的方法。
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