Finally, the chips and the matching components are assembled in the package by bonding and sintering. And the matching circuit is adjusted to make the chips demonstrate better performance.
最后,通过烧结、键合把管芯和匹配元件装配在管壳内,调整匹配电路,使管芯发挥出更好的性能。
参考来源 - 内匹配型Ku波段大功率器件的设计与实现·2,447,543篇论文数据,部分数据来源于NoteExpress
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