The effects of choosing lapping bevel Angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.

讨论了在检测半导体器件和集成电路芯片时，不同研磨倾斜角度对扩展电阻量值的影响。

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The experimental results indicate that the method improves classification performance with more compact representation when less time of training and testing is required than that of LSI.

实验表明当需要比LSI更少的训练和测试时间时，该方法能够以更为紧凑的表示方式提高分类性能。

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Performance evaluation of the LSI engineering sample chip was completed previously, and as of today, all testing required to confirm interconnectivity to the mobile networks of major vendors has also been completed.

ENGADGET: Panasonic, DoCoMo, NEC and Fujitsu create IP for multi-standard LSI chip; supports LTE, GSM, W-CDMA and HSPA+