low-temperature cure 低温固化
low pressure high-temperature cure 低压高温硫化
Technologies of low cost composite structures, including low temperature cure, liquid forming, radiation cure are put forward to solve this problem in this paper.
文章提出了低温固化、液体成型、辐射固化等几种低成本制造技术用以解决这个问题。
Liquid injection molding utilizes low viscosity silicones which can be pumped at lower pressure and temperature, and cure in significantly less time and with less waste than solid materials.
液体侵渍模塑使用低粘度的硅树脂，在低压和低温条件下抽运，在极短的时间内固化，与固体材料相比，废弃物少。
A semiconductor cooler with constant temperature is introduced in this paper. And it is used in clinical cure by low temperature.
介绍一种恒温控制的半导体制冷器，用于临床上的低温治疗。
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