其他挑战包括:微影蚀刻法(lithography and etching)中发光电阻器(LER)的栅极长度CD控制和抑制,对新栅极材料、非平面晶体管结构、光刻胶的发光电阻器以及深紫外光刻的测量。
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The sensor is fabricated by traditional lithography and etching.
制作采用的是传统的光刻、刻蚀工艺。
Using MEMS technics to process the silicon vibration element, in the process two side lithography and etching has being used many times.
介绍了旋转载体用硅微机械陀螺敏感元件的结构和利用双面多次光刻、腐蚀等微机械工艺加工得到硅振动单元的工艺过程。
Some polymer materials are used as substrate. Kinds of new microfabrication technology are presented, including lithography, soft etching, LIGA, DEM and bonding, etc.
系统介绍了芯片实验室的各种制备技术,这些技术包括紫外光刻、软刻蚀、LIGA技术、DEM技术、键合等。
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