Wire bonding is still the most popular interconnect technology in the first-level packaging.

一级封装中最流行的互连技术仍为丝焊。

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This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.

文章论述了超csptm圆片级封装技术工艺。

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The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.

本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。

youdao

The second aspect is Formalism which I describe the level of definition, packaging and application of the methods and practices of social businesses.

FORBES: Constellation Research Group's Maturity Model for Social Business

To satisfy that level of demand, flexible packaging companies will need to be innovative partners with their customers.

FORBES: Written by Jack Knott

Ask yourself if your packaging appropriately represents you and your brand, and elevates your content to the next level.

FORBES: Packaging Counts