The backing material must be as smooth as possible, and the circuitry sealed beneath a layer composed of a polymer-metal-polymer sandwich.
这种电路的基板材料也非常平滑，在这个电路的下次是由聚合物-金属-聚合物这种类似三明治的夹心结构组成的。
The smooth interior surface is achieved through mechanical polishing and generally followed by electropolishing, which removes the surface layer and its impurities.
平滑的内表面是通过取出表面层和杂质的机抛和在次之后再电抛得到的。
The blasting mechanism of smooth blasting soft mat layer charging construction (for example, air layer and layer) is introduced.
以空气垫层和水垫层为例介绍软垫层光面爆破装药结构爆破机理。
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