• 横向偏移 - 引用次数：3

  The results showed that with the size of the pad increasing, the stand-off height of the solder joint decreased greatly, the pitch angle decreased little, the lateral excursion and the yaw increased greatly.

  结果发现:随着焊盘尺寸的增加,焊点间隙高度明显下降,光纤高度倾斜角有少量地减少,横向偏移和焊后偏角都明显地增加。

  参考来源 - 激光软钎焊条件下光纤自对准的实验研究

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