...照其用场又有：激光再流焊(Laser Reflow Soldering)、激光钎料键合(Laser Solder Bonding)、激光钎料植球(Laser Solder Bumping)等称谓，但基本毗连的道理是相符的哄骗激光对毗连部位加热、熔化钎料，使成为事实毗连其独特之处很是显著：只对毗连部位局部加热...
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laser solder bumping
激光焊接碰撞
以上为机器翻译结果，长、整句建议使用 人工翻译 。
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
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