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laser chip package

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“Tenth Five-Year” period, the largest sub-group taking the diversified development of roads, the implementation of a full range of industrial restructuring, involved in Product packaging, wood, optoelectronics three categories of ultra-thin aluminum foil, aluminum foil composite materials, tobacco use C fibril beam, strengthening and solid wood flooring, optical communication components, laser chip package, such as 10 kinds of products, the company has maintained a sustained, steady and rapid development. 2005 Jiangsu Asia Technology Group Co.

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laser chip package

激光芯片封装

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