Transistor thermal spectrum, as a new method, different from the commonly infrared thermogram, is introduced to characterize the non-uniform property of the junction temperature distribution.
晶体管热谱是表示晶体管结温不均匀性的一种与热像图不同的新方法。
In this thesis, Sallow junction formation and low thermal budget control are important for advanced device manufacturing.
在本论文中，对于先进元件的制造上，浅接面的形成和热预算的控制是很重要的。
In addition, Thermal Force-Directed Placement Algorithm is used, detailed analysis of the device optimized layout of the component junction temperature and the average PCB temperature are shown.
另外，本文还运用热力导向优化算法，分析了电子元器件的优化布局对元器件的结点温度的影响。
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