High performance can be obtained for the integrated power electronics module (IPEM) by using a three-dimensional packaging structure instead of a planar structure.
采用三维封装结构取代传统的平面封装结构可获得高性能集成电力电子模块。
And it is also a method to check the measuring experiment which we have build. 4 Carry out the evaluating methods study of capability for the IPEM based on the liquid cooling substrate.
这同时也是对所构建的测试平台的一种检验。4对电力电子集成模块微通道液冷基板的性能评价方法进行了研究。
应用推荐