... 层间接触 印制电路板的ninterlayer contact 层间连接 interlayer connection 层间阻抗 layer impedance ...
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Graphite matrix had new phase with alloying elements. It was conducive to the connection between the matrix and the interlayer.
石墨基体中也明显有含合金元素的新相生成，有利于实现基体与中间层的连接。
Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.
由此，得到一种层间连接部被压缩且具有高连接可靠性的多层印刷线路基板。
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