The annealing behavior of the resistivity is correlated with the microstructure and interfacial diffusion of the films.
薄膜电阻率随退火温度的变化行为与薄膜微观结构的变化以及界面扩散有关。
The interfacial diffusion of alloying element is important to microstructure, microhardness and interfacial bonding strength.
合金元素在界面两侧的扩散是影响材料显微组织、显微硬度及界面结合强度的关键。
Once the length scale was upon a critical value, this effect turned to be weakened and the interfacial diffusion became invisible.
在高于临界调制波长和调制比情况下，互促效应弱化，薄膜界面扩散行为不明显。
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