The structure of the Light path transition module and unit module, and the interconnection board were designed.
对光路转换模块和单元模块以及该互连板的总体结构进行了分析和设计。
The invention further provides an integrated preparation method for the memory unit in the copper interconnection process.
本发明还进一步提供了上述存储单元在铜互连工艺中的集成制备方法。
In chapter 4, we study the theory of optical interconnection and discuss the design of switching unit of optical Network-on-Chip based on micro-resonator.
第四章对光互连理论进行研究，讨论基于微谐振器的芯片光互连交换单元的设计并评估其性能。
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