The method comprises a step of removing a thin slice of the integrated circuit chip from part of the thickness along the direction vertical to the structure length.

所述方法包括以沿垂直于所述结构长度的方向的方式从所述厚度 的部分去除一所述集成电路芯片的薄片。

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The method also provides an integrated circuit chip with a thickness, a width and a length.

所述方法也提供具有厚度、宽度和长度的集成电路芯片。

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