Rare earth improved electroless plating method was developed for simultaneously depositing Pd-Ag alloy film on ceramic support.

采用稀土改进的化学镀法在多孔陶瓷载体上共沉积钯-银合金膜。

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A self-limiting electroless plating process is provided to plate thin films with improved uniformity.

本发明提供一种自限制化学镀方法，以镀具有改进的均匀性的 膜。

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Compared with conventional electroless nickel plating process, the deposits obtained are greatly improved with higher phosphorus content, hardness, more compact and uniform microstructure.

与传统化学镀镍工艺相比，该工艺所得镀层含磷量高、硬度高，组织结构致密均匀。

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