As a vertical interconnect channel, through-hole plays an important role in multi-layer PCBs and IC packages.
通孔作为垂直互联的主要实现方式在多层印制电路板和芯片封装中起着至关重要的作用。
Measurement of coating thickness in the proof-test of IC packages and metal cases using X-Ray Fluorescence (XRF) spectrometry is described.
介绍了在外壳检验中，应用X射线荧光光谱法（XRF），对外壳的镀涂层厚度进行测试；
IC package is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
电子封装作为电子系统的最小组成部分，其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。
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